Panasonic Placement Machine NPM-D3

Payment Type: T/T
Incoterm: FOB,CIF,EXW
Min. Order: 1 Bag/Bags

Basic Info


Model No.: NPM-D3


Additional Info


Packaging: Vacuum packing in wooden cases

Brand: Panasonic

Transportation: Ocean

Place of Origin: Japan

Port: Hong Kong


Product Description

Panasonic Chip Mounter NPM-D3


Features & Benefits

1. High area productivity with total mounting lines
Higher productivity and quality with placement and inspection process integration.
2. Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.
3.Comprehensive control of lines, floor and factory with system software

Production plan support through line operation monitoring.


Specifications

 Model ID                                                                          NPM-D3
                                       Rear head
 Front head
   Lightweight
16-nozzle head
 12-nozzle head   8-nozzle head      2-nozzle head    Dispensing head       No head
 Lightweight 16-nozzle head                                          NM-EJM6D   NM-EJM6D-MD    NM-EJM6D
 12-nozzle head
 8-nozzle head
 2-nozzle head
 Dispensing head                                       NM-EJM6D-MD             --  NM-EJM6D-D
 Inspection head                                       NM-EJM6D-MA  NM-EJM6D-A
 No head                                         NM-EJM6D    NM-EJM6D-D            --  

 PCB  dimensions*1 

(mm)

Dual-lane mode L 50 x W50 ~ L 510 x W 300
Single-lane mode L 50 x W50 ~ L 510 x W 590
 PCB
exchange
 time
Dual-lane mode 0 s* *No 0s when cycle time is 3.6 s or less
Single-lane mode 3.6 s* *When selecting short conveyors
 Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
 Pneumatic source *2 0.5 MPa, 100 L /min (A.N.R.)
 Dimensions *2 (mm) W 832 x D 2 652 *3 x H 1 444 *4
 Mass 1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement head                        Lightweight 16-nozzle head
                             ( With Dual Heads )
     12-nozzle head
   (With Dual Heads )
     8-nozzle head
 ( With Dual Heads )
               2-nozzle head
           ( With Dual Heads )
High production mode [ON] High production mode [OFF]
Placement speed      Max.  speed             84 000 cph
         (0.043 s/ chip )
              76 000 cph
           (0.047 s/ chip )
         69 000 cph
      (0.052 s/ chip )
      43 000 cph
    (0.084 s/ chip )
                11000 cph
             (0.327 s/ chip )
                 8500 cph
             (0.423 s/ QFP)
    IPC9850-1608            63 300 cph*5            57 800 cph*5         50 700 cph*5                -                          -
Placement accuracy
(Cpk1)
          ± 40 µm/chip           ±30 μm / chip
        (±25 μm / chip*6)
        ±30 μm / chip ± 30 µm/chip
        ± 30 µm/QFP
      12mm to 32mm
      ± 50 µm/QFP
       12mm Under
               ± 30 µm/QFP
Component
dimensions
(mm)
(01005") 0402 chip*7 to L 6 x W 6 x T 3 03015"*7*8/(01005") 0402 chip*7 to L 6 x W 6 x T 3 (01005") 0402 chip*7 to L 12 x W 12 x T 6.5 (01005") 0402 chip*7 to L 32 x W 32 x T 12 (0201") 0603 chip to L 100 x W 90 x T 28
Component Taping Tape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 8 to 56 / 72 / 88 / 104 mm
8 mm tape : Max. 68 (8 mm thin type single feeder, double tape feeder, small reel)
Stick,Tray                                                                - Stick : Max. 8
Tray : Max. 20 (per tray feeder)

Dispensing head Dot dispensing Draw dispensing
Dispensing speed

0.16 s/dot

 (Condition : XY=10 mm, Z=less than 4 mm movement, No θ          rotation)

4.25 s/component

 (Condition: 30 mm x 30 mm corner dispensing)*13

Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP SOP,PLCC,QFP, Connector, BGA, CSP


Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *9
0.35s/ View size
Component
Inspection *9
0.5s/ View size
Inspection
object
Solder
Inspection *9

Chip component : 100 μm x 150 μm or more

 (0603 / 0201" or more)

Package component : φ150 μm or more
Chip component : 80 μm x 120 μm or more (0402 / 01005" or more)
Package component : φ120 μm or more
Component
Inspection *9
Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection
items
Solder
Inspection *9
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *9
Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12
( Cpk1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *9
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *9
Max. 10 000 pcs./machine

*1 : Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) dual lane specs cannot be established.

*2 : Only for main body

*3 : Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm
*4 : Excluding monitor and signal tower
*5 : It is the reference value of the tact time by the IPC9850 conformity. (The independent mode)
*6 : ±25 μm placement support option.(Under conditions specified by PFSC)
*7 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*8 : Support for 03015 mm chip placement is optional. (Under conditions specified by PSFC : Placement accuracy ±30 μm / chip )
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.
*13 : A PCB height measurement time of 0.5s is included.
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

Panasonic machine NPM-D3

     Shenzhen Keith Electronic Equipment Co., Ltd." located in Baoan District, Shenzhen. It is a supplier of AI and SMT equipment, spare parts, consumables and auxiliary consumption materials in China. Over the years, we have provided advanced equipment and parts for our customers to ensure high-quality service. And for exporting market, we are planing to developing Europe, North America, South America, Southeast Asia,India and where need SMT equipment spare parts.
     Business philosophy: cooperation, win-win, innovation, mutual assistance
     We have been adhering to the brand management concept of "focusing on product quality and customer needs", through the implementation of open innovation, excellent operation management, human resources development and other strategies, to comprehensively construct the core competitiveness of the company, create customer and social values, and win the unanimous praise of the vast number of customers and society.
    Main products:
    Panasonic Insertion Machine, Panasonic Insertion Machine Parts, Panasonic Placement Machine, Panasonic Placement Machine Parts, Panasonic Feeder & Feeder Parts, Feeder Trolley, SMT Squeegee etc. To learn more about our products, please contact us through the following email address, look forward to your cooperation!

Contact Info

CONTACT US

Shenzhen Keith Electronic Equipment Co., Ltd.

Address: Honghai Business Center 521, Songgang Street,Shenzhen,Guangdong

Contact Person: Nicolas

Phone:86-0755-23284593

Fax:

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