Panasonic provides extremely dependable electronics assembly equipment in the areas of SMT (surface mount technology), PTH (pin through-hole), and processes involving microelectronics back-end packaging of any-mix circuit manufacturing. We offer first-class equipment ranging from screen printers and dispensing, through component placement and inspection, up to axial and radial insertion, die bonding, die attach and flip chip. Our equipment is used all around the world to enable the production of the most modern technology.
Our variable machines in modular format support a large range of technologies and, from the installation of just one machine through to assemblies of over 1,000, can take care of processes such as, COB (chip on board), SOP (system on package), epoxy die attach, POP (package on package), 3D packaging, TS (thermo-sonic) and TC (thermo-compression) processing, plasma RIE surface cleaning, plasma ICP etching, and thin wafer plasma dicing. To perform odd-form placement and end-of-line work, we also offer automated equipment.